In semiconductor equipment, composites are gradually replacing traditional metal materials due to their light weight, high rigidity, chemical corrosion resistance, and antistatic properties, to meet the demands of more precise and higher-speed processes. Among them, composite materials are mainly used to enhance equipment durability, precision, and process efficiency. Key applications include: carbon fiber composite materials (C/C) for high-temperature etching and baking equipment, engineering plastics (such as PEEK) for high-temperature connectors and insulation, wear-resistant thermoplastic composite materials for pumping systems, and high-purity metal-matrix/ceramic composite materials for wafer processing components. These materials effectively reduce wear, enhance stability, and meet cleanroom requirements.